Integrated Circuits Fabrication Technology
Class Syllabus: EEC 146A
This is a sample syllabus from the Fall 2004 quarter.
Syllabus for the sequel: EEC 146B.
Required Material:
- Introduction to Microelectronic Fabrication, 2nd Edition by R.C. Jaeger, Prentice Hall, 2002
Grading:
- weekly labs (45%)
- weekly problems (10%)
- midterm & final exam (45%)
Class Flow:
Week 1
- Lecture: introduction, lab safety, cleaning, pure water
- Lecture: MOS process flow
- Lab: lab safety, gowning, wafer cleaning, and wafer handling
Week 2
- Lecture: resist application, softbake
- Lecture: photolithography and patterning
- Lab: photolithography
Week 3
- Lecture: chemical polishing and wet etch, oxidation
- Lecture: field oxidation, thickness measurement
- Lab: gas oxidation
Week 4
- Lecture: gate oxidation and ellipsometry
- Lecture: using ellipsometer, oxide protection
- Lab: alignment of mask layers
Week 5
- Lecture: oxide etching, diffusion processing
- Lecture: diffusion processes, sheet resistance, junction dept
- Lab: polysilicon gate etching, ellipsometry
Week 6
- Lecture:
- Lecture: midterm exam
- Lab: boron diffusion and reoxidation
Week 7
- Lecture: physical vapor deposition, thin films
- Lecture: metal to semiconductor interfaces
- Lab: contact holes, sheet resistance
Week 8
- Lecture: liftoff processes, metallization
- Lecture: annealing, interface states, defects
- Lab: photolithography using lift-off
Week 9
- Lecture: defects, parametric testing, device probing
- Lecture: process monitoring, yield
- Lab: liftoff and metallization
Week 10
- Lecture: dicing, bonding, packaging
- Lecture: failure, yield modelling
- Lab: parametric testing